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3D BGA Reballing Stencil Kit For Motherboard Middle Layer Planting Tin Template Reballing Plate Soldering Net

3D BGA Reballing Stencil Kit For Motherboard Middle Layer Planting Tin Template Reballing Plate Soldering Net

Name: 3D BGA Reballing Stencil Kit For Motherboard Middle Layer Planting Tin Template Reballing Plate Soldering Net
Brand: Hhwj
Price: 68.42 EUR
Availability: InStock

Product ID: 155816460

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Frequently Bought Together

Description

Particle Size:1-10Μm
Usage:Repair For Iphone X
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Particle Size:1-10ΜmUsage:Repair For Iphone X

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TrustScore 4.5 | 7,300+ reviews

Farhan Q.

The delivery time was excellent, and the packaging was secure.

2 months ago

Ravi S.

I loved the variety of products available. Will definitely shop again.

2 months ago

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€ 68.42

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Trustpilot

TrustScore 4.5 | 7,300+ reviews

Anita G.

Good experience, but the tracking updates could be better.

2 months ago

Yusuf A.

Fantastic experience overall. Will recommend to friends and family.

1 month ago

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